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Elevate Your Electronics with Customized PCB Production Services

TONGZHAN INDUSTRIAL LIMITED
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Elevate Your Electronics with Customized PCB Production Services

Brand Name : CUSTOM MADE

Certification : ISO/UL

Place of Origin : China

MOQ : Negotiable

Price : Negotiable

Payment Terms : T/T

Supply Ability : 100000pc/Month

Delivery Time : 4 weeks

Packaging Details : PCB + Box

Keyword : Printed Circuit Board Fabrication

Insulation : FR4 board, aluminum substrate, copper substrate, ceramic substrate, PI (polycumimine), PET (poly)

Copper foil material : Glue-free calendered copper, rubber-rolled copper, glue-based electrolytic copper

number : 1-12 floors

The finished board is thick : 0.07MM AND ABOVE (TOLERANCE +5%)

The inner layer is thick copper : 18-7OUM (1 ounce copper = 35UM)

The outer layer is thick copper : 20-14OUM (1 plate copper = 35UM)

Solder mask : Red oil, green oil, butter, blue oil, white oil, black oil, matte black oil, yellow film covered white film, black film

word : Red, green, yellow, blue, white, black silver

Surface treatment : Anti-oxidation (OSP), tin spraying, gold immersion, gold plating, silver plating nickel plating, gold plating finger, carbon oil

Special processes : Thick copper plate, impedance plate, high frequency plate, half-hole plate, orifice plate, hollow plate, single-layer copper foil, cross-sided gold finger plate, soft and hard combination

Reinforcement type : PI, FR4, steel sheet, 3M glue, electromagnetic shielding film

Maximum size : 50OMM*1000MM

Outer line width/line spacing : 0.065MM( 3MIL)

Inner line width/line spacing : 0.065MM(3MIL)

Minimum solder mask width : 0.10MM

Minimum mask bridge width : 0.05MM

Minimum solder mask : 0.45MM

Minimum aperture : MECHANICAL DRILLING 0.2MM, LASER DRILLING 0,1MM

Impedance tolerance : 10% of soil

Form tolerances : +0.05MM(LASER+0.005MM)

Molding method : V-cut, CNC, die punching, laser

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Elevate Your Electronics with Customized PCB Production Services

Innovative PCB Fabrication For Unsurpassed Quality And Flexibility

Key Steps In Printed Circuit Board Manufacturing:
1. Design: First, circuit board designers create circuit diagrams and layouts using computer-aided design (CAD) tools. This includes determining component locations, connections, and circuit paths.
2. Substrate Preparation: Non-conductive substrates are typically made from fiberglass-reinforced epoxy resin. These substrates are subsequently processed through cutting and lamination processes.
3. Conductive layer deposition: Deposition of conductive material (usually copper) on the surface of a substrate to form a circuit pattern. This can be done through chemistry, electroplating, or other techniques.
Patterning: Using photolithography or etching to remove unwanted portions of a conductive layer, leaving the desired circuit pattern.
4. Component placement: Use automated equipment to accurately place electronic components such as resistors, capacitors, and integrated circuits onto circuit boards.
5. Soldering: Components and circuit boards are connected through a soldering process. This can be done using surface-mount technology (SMT) or through-mount technology (THT).
6. Testing and Quality Control: Once completed, the board goes through a series of tests to ensure that all components are connected correctly and the circuit is working properly. The quality control process also includes visual inspection and measurement.


Printed Circuit Board Fabrication Parameters:

Name

Printed Circuit Board Fabrication

Reinforcement type

PI, FR4, steel sheet, 3M glue, the electromagnetic shielding film

Insulation

FR4 board, aluminum substrate, copper substrate, a ceramic substrate, PI (polycumimine), PET (poly)

Maximum size

50OMM*1000MM

Copper foil material

Glue-free calendered copper, rubber-rolled copper, glue-based electrolytic copper

Outer line width/line spacing

0.065MM( 3MIL)

number

1-12 floors

Inner line width/line spacing

0.065MM(3MIL)

The finished board is thick

0.07MM AND ABOVE (TOLERANCE +5%)

Minimum solder mask width

0.10MM

The inner layer is thick copper

18-7OUM (1 ounce copper = 35UM)

Minimum mask bridge width

0.05MM

The outer layer is thick copper

20-14OUM (1 plate copper = 35UM)

Minimum solder mask

0.45MM

Solder mask

Red oil, green oil, butter, blue oil, white oil, black oil, matte black oil, yellow film covered white film, black film

Minimum aperture

MECHANICAL DRILLING 0.2MM, LASER DRILLING 0,1MM

word

Red, green, yellow, blue, white, black silver

Impedance Tolerance

10% of soil

Surface treatment

Anti-oxidation (OSP), tin spraying, gold immersion, gold plating, silver plating nickel plating, gold plating finger, carbon oil

Form tolerances

+0.05MM(LASER+0.005MM)

Special processes

Thick copper plate, impedance plate, high-frequency plate, half-hole plate, orifice plate, hollow plate, single-layer copper foil, cross-sided gold finger plate, soft and hard combination

Molding method

V-cut, CNC, die punching, laser


Printed Circuit Board Fabrication Factory Introduction:
Tongzhan Industrial Ltd. was established in 2011 in Shenzhen, Guangdong Province. Tongzhan Industrial Ltd. is committed to becoming a leading one-stop EMS supplier company, providing customers with high-quality PCB series products. Tongzhan mainly focuses on high-speed turnkey PCB layout design and PCB assembly services, including PCB design, manufacturing, component procurement, PCBA design and board making, supply chain services, functional testing, conformal paint, complete assembly, etc. Our corporate culture is to serve customers, customers always come first. Customer-oriented, diligent and innovative, honest, happy, transparent, customer-centric, professional, efficient, and win-win. Our employees are passionate. Passion for Science. Passion for technology.
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